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DSR-800
Liquid photoimageable double-sided solder mask ink with good printability and exceptional heat resistance.
  • Describe
  • DSR-800 offers excellent printability, outstanding heat resistance, and a wide process window. It is a highly versatile, user-friendly liquid photoimageable solder mask ink suitable for a broad range of applications.

    Ink Properties:

    Item

    Specification

    Remarks

    Color

    Medium Green

     

    Fineness

    ≤8 μm

    0~25 μm grind gauge

    Mixing Ratio

    Base Ink/Hardener = 3:1

    Weight ratio

    Solids after Mixing

    75±3%

     

    Viscosity after Mixing (25°C)

    200±30dPa ·s

    VT-04F

    Density after Mixing (25°C)

    1.20~ 1.30g/ml

     

    Pot Life after Mixing

    24 hours

    Below 25°C; protected from light

    Environmental Standard

    RoHS Directive compliant

    SGS tested

    Pre-bake Limit

    75°C, 60min

     

    Exposure Energy

    300~500mJ/cm2

    UV energy at ink surface

    Packaging

    Base Ink: 750g; Hardener: 250g

    Standard packaging

    Base Ink: 3.75kg; Hardener: 1.25kg

    Shelf Life

    6 months from date of manufacture

    Sealed below 25°C; protected from light

     

    Coating Performance:

     

    Item

    Specification

    Remarks

    Pencil Hardness

    ≥6H

    Pencil hardness tester, JIS K5400 8.4

    Adhesion

    100/100

    Cross-cut test, JIS K5400 8.5

    Solvent Resistance

    No change

    Alcohol immersion at 25°C for 20 minutes

    Acid Resistance

    No change

    10vol% H₂SO₄ immersion at 25°C for 20 minutes

    Alkali Resistance

    No change

    10wt% NaOH immersion at 25°C for 20 minutes

    Boiling Water Resistance

    No change

    Boiling-water immersion at 100°C for 30 minutes

    Insulation Resistance

    ≥1.0 × 1012 Ω

    IPC-SM-840C 3.8.2

    Solder Heat Resistance

    No blistering or delamination at 288°C×10 sec×3 cycles

    JIS C6481 5.5

    Flammability

    UL94 V-0

    Certification No.: UL-E 189612

    ENIG

    No blistering or delamination

    Ni: 5 μm; Au: 0.05 μm

    Electroplated Gold

    No blistering or delamination

    Ni: 5 μm; Au: 1.0 μm

     

     

    Notes:

    1. Before use, mix the base ink and hardener thoroughly at the specified ratio.

    2. If thinning is required, use high-purity Butyl Cellosolve (BCS) or DPM.

    3. The data herein are based on our laboratory test results and are provided for reference only. Customers should conduct verification tests before establishing appropriate operating conditions.

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