SSR-500 UV-curable solder mask ink is a high-performance, halogen-free product designed specifically for printing solder mask patterns on printed circuit boards (PCBs). It offers excellent printability, high solder heat resistance, high chemical resistance, rapid curing, and high gloss. After curing, it provides stable and reliable adhesion, heat resistance, and electrical properties. Its especially wide process window enables it to withstand various highly acidic no-clean fluxes, making it suitable for Reflow Soldering, Wave Soldering, and HASL processes.

Ink Properties:

Process Parameters for UV-Curable Solder Mask Ink

1: Mixing and Standing

Stir thoroughly for 15—30min, then allow to stand for 15min before use.

2: Substrate Pretreatment

Clean with a 3%—5% aqueous sulfuric acid or hydrochloric acid solution; use 300- and 500-mesh brush rollers; dry at 80‑120°C.

Brush mark width: 15—20mm; water-break time: at least 15 seconds.

3: Printing

Mesh: 100—120T screen

Tension: 23—28N/cm2

Squeegee hardness: 70-75°

Squeegee angle: 60-80°

Snap-off distance: 4—6mm. The squeegee shall extend 10—20mm beyond each side of the printed pattern.

Machine printing pressure: 3-6Kgf/cm2

Printed film thickness: 10-15μm

4: Curing

3 × 80W/cm lamps. Energy: 1OZ, 1500±500mj/cm2; 2OZ, 2500±500mj/cm2.

Note: Conveyor speed and exposure energy vary significantly with equipment. Adjust settings to achieve complete ink curing. Lamp distance: 8—10cm; limit lamp service time to within 1000 hours.

Precautions for UV-Curable Solder Mask Ink:

1.   Stir the ink thoroughly for 15 minutes before use to improve its rheological properties;

2.   No thinner is required during use. If the viscosity is too high, use the dedicated thinner, not exceeding 5% of the ink quantity;

3.   Minimize moisture absorption during use. Keep unused ink sealed;

4.   The ink film is thicker at the edges of 20Z circuitry. A 275-mesh (110T) screen and a 75°C squeegee are recommended to reduce film thickness.

5.   For lead-free HASL, post-bake at 150°C×30min.

6.   Oxidation or contaminants such as grease can impair adhesion and cause blistering during soldering. Therefore, the substrate must undergo thorough pre-print surface treatment and be completely dried.

7.   Flux selection also significantly affects solder mask blistering and should be made carefully;

8.   Do not mix this product with other brands of ink, as this may cause defects such as white spots or ink peeling after printing;

The data herein are based on our laboratory test results and are provided for reference only. Customers should conduct verification tests before establishing appropriate operating conditions.